AGC Micro Hole Drilling Processing Technology for Ultra-thin Glass could Enable Laminated Semiconductors
Tokyo, Mar 6, 2012 (JCN) - Asahi Glass Co. Ltd (AGC) has developed an ultra-high speed processing technology for micro hole drilling processing of ultra-thin glass with a thickness of 0.1 millimeter. The combination of this micro hole drilling processing technology and the production technology for ultra-thin glass has opened the door for glass to be used in leading-edge applications such as laminated semiconductors.
Laminated semiconductors are produced by vertically stacking semiconductor chips for enhanced performance, and are connected to a printed circuit board via an interposer. This interposer needs many holes with a diameter of about 50 micrometers to connect through-electrodes of semiconductors. So far, thin sheet glass with a thickness of about 0.3 millimeters draws attention as a raw material for interposers, but it has been difficult to drill micro holes in such thin glass using conventional technologies.
By applying the newly-developed micro hole drilling processing technology for ultra-thin glass to process glass interposers, AGC will be able to drill holes precisely and at high speed to connect through-electrodes.
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